Last Updated： Aggregation Period:Jan 07, 2026～Feb 03, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Jan 07, 2026～Feb 03, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Jan 07, 2026～Feb 03, 2026
This ranking is based on the number of page views on our site.
1～30 item / All 96 items
2nd/3rd generation Core i3/Celeron equipped CPU module
Features ■ 2nd/3rd Gen Core i3/Celeron ■ DDR3 SO-DIMM x 2 (up to 16GB) ■ Equipped with VGA, DisplayPort, DVI-I, and 24-bit single channel LVDS ■ Includes watchdog timer and digital I/O
Socket LGA1151 6th generation Core i7/i5/i3 Skylake-S compatible CPU module new
Features ■ Supports 6th generation Core i7/i5/i3 Skylake-S processors (LGA1151) ■ DDR4-2133 ECC/Non-ECC SODIMM x 1 (up to 16GB) ■ Supports VGA, LVDS/eDP, 2x DDI (DP/HDMI/DVI) displays (carrier board) ■ PCI Express 3.0 [x16] x 1 (carrier board)
6th generation Core i7/i5/i3/Celeron Skylake-H equipped CPU module new
Features ■ Type 6 COM Express module ■ Equipped with 6th generation Core i7/i5/i3/Celeron Skylake-H processors ■ DDR4-2133 ECC/Non-ECC SODIMM x 2 (up to 32GB) ■ Supports VGA, LVDS/eDP, 2x DDI (DP/HDMI/DVI) displays (carrier board) ■ PCI Express Gen3 compatible (carrier board)
Equipped with Pentium N4200/Celeron N3350/Atom E3950/E3940/E3930 CPU
Features ■ Equipped with Pentium N4200/Celeron N3350/Atom E3950/E3940/E3930 CPU. ■ Onboard memory 1867MHz DDR3L (up to 8GB) ■ Supports dual channel LVDS (18/24-bit), HDMI/DP++, DP++, and three independent display outputs. ■ 2x MIPI CSI camera (2/4 lanes) ■ 1x GbE with IEEE1588, 1x SATA 3.0, onboard eMMC ■ Extended operating temperature: -40℃ to +85℃ (optional)
Trizeps SODIMM-200 CPU module, NXP i.MX 8M Mini family
Features ■ Equipped with NXP i.MX 8M Mini application processor ■ Supports 1x Gigabit Ethernet, WiFi/Bluetooth, USB 2.0, LVDS ■ GC3202D accelerator + GCNanoUltra3D accelerator ■ Onboard LPDDR4-3200 memory up to 8GB ■ Operating temperature 0 to 70℃ (optional: -40℃ to 85℃) ■ Dimensions: 67.6 x 36.7 x 6.4 mm ■ OS Win10 IoT/Debian/Yocto/Android
NXP i.MX 8M Plus Family, ARM Cortex-A53, size 50x82mm
Features ■ Equipped with NXP i.MX8MPlus application processor ■ 2x Gigabit Ethernet; optional Wi-Fi + BT 5.0; 2x CSI camera; 2x USB 3.0; 3x USB 2.0; 1x PCI-e x1; 2x CAN Bus; 4x UART; 14x GPIOs; supports QuadSPI interface ■ Integrated GPU supporting three independent displays ■ Onboard LPDDR4-4000 with up to 6GB memory ■ Operating temperature 0 to 60°C (optional: -40°C to 85°C) ■ Size: 50 x 82 mm (1.97” x 3.23”) ■ Compatible with Linux OS
12th Core i series, 2xDDR5-4800 maximum 64GB memory, size 120x95mm
Features ■ Supports 12th generation Intel Core processors (Codename: Alder Lake – H series) ■ 2x 2.5GbE; 4x USB4 Gen 2x2; 4x USB2.0; 8x PCIe x1 Gen3, 1x PCIe x8 or 2x PCIe x4 Gen4; Optional on-board WiFi 6E + BT 5.2 ■ Intel Iris Xe Architecture with up to 96 EUs, up to 4 independent displays ■ Supports 2xDDR5-4800 memory up to 64GB ■ Operating temperature 0–60℃ (Optional: -40–85℃) ■ Dimensions: 120x95mm ■ OS Win Server2022/VxWorks7.0/Ubuntu/Linux/Yocto/Android
11th Xeon W-11000E/Core i series, equipped with 2xDDR4-3200 ECC, maximum 64GB memory.
Features ■ Supports 11th generation Intel Xeon, Core, and Celeron processors ■ 2x USB 4; 2x USB 3.2 Gen 2x2; 8x USB 2.0; 20x PCI-e Gen3 lanes; 20x PCI-e Gen4 lanes; supports up to 2x 2.5GbE ■ Intel Iris Xe Graphics Core Gen12 GPU with up to 32 EU, supports up to 4 independent displays ■ Equipped with 2x DDR4-3200 ECC memory, maximum 64GB ■ Operating temperature 0 to 60℃ (optional: -40 to 85℃) ■ Dimensions: 120x95mm ■ OS: Win10 IoT/Linux/Yocto/VxWorks7.0/Android
MediaTek Genio 510 SoC 2x Arm Cortex-A78 & 4x A55, LPDDR4 up to 4GB
【ADLINK OSM-MTK510 Features】 ■Dimensions: 45mm x 45mm ■Equipped with Genio 510 (Dual-core Cortex-A78 + Quad-core Cortex-A55) ■Includes Ethos U-VP6 AI processing unit ■Graphic output interfaces: HDMI/DisplayPort (DP), eDP, DSI ■LPDDR4 up to 4GB ■eMMC up to 128GB ■1x USB 3.0, 2x USB 2.0, 4x UART, 3x SPI, 2x I²S interfaces, 3x I²C interfaces, 17x GPIO ■RGMII LAN MAC interface supporting 10/100/1000 Mbps ■Complies with IEC 60068-2-64 and IEC-60068-2-27, MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D
ADLINK, NXP i.MX8M Plus with 4-core Cortex-A53 & M7, LPDDR4L up to 8GB
【ADLINK OSM-IMX8MP Features】 ■Dimensions: 45mm x 45mm ■NXP i.MX8M Plus series (4-core Cortex-A53 + Cortex-M7) ■Equipped with TrustZone technology supporting Armv8 cryptographic functions ■2.3 TOPS Neural Processing Unit (optional) ■Graphic output interfaces: HDMI, LVDS, DSI ■LPDDR4L up to 8GB ■eMMC up to 128GB ■2x USB 3.0, 2x USB 2.0, 2x CAN2.0, 4x UART, 3x SPI, 1x I²S interface, 2x I²C interfaces, 8x GPIO ■Dual GbE (one port supports TSN) ■Supports extended temperature range -40°C to 85°C ■Complies with IEC 60068-2-64 and IEC-60068-2-27, MIL-STD-202 F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D
Intel Atom/Celeron Processor Q7 Module
● Intel Atom / Celeron Processor Q7 Module ● iManager WISE-PaaS / RMM, and Embedded Software API ● LVDS and HDMI / DP support H.264, MPEG2 HW decode/encode ● Onboard dual-channel DDR3L-1333 up to 8GB, eMMC up to 32GB ● Qseven R2.0 CPU Module ● Intel Atom / Celeron Processor Q7 Module
How about developing with the high-performance and reasonably priced i.MX9 series as a successor to the i.MX8?
The i.mx series, along with ARM-SOC, is soaring in price due to the weak yen. Therefore, Mitsui Electronics has developed a CPU module for the i.MX93/91. If we continue to use the current products, the cost of materials will only continue to rise. How about developing a successor model with NXP's new i.mx9 series? The i.MX93 is a cost-performance model that shrinks unnecessary functions, allowing for performance improvements on existing products while enabling cost reductions. Additionally, it has been developed as a CPU module that also supports the more affordable i.MX91. Leave the design of the carrier board and the CPU board to us!
Low power consumption significantly reduces the board space required for power conversion devices and power lines! A credit card-sized computer module!
The SMARC is a versatile small form factor computer module targeting applications that require low power, cost-effectiveness, and high performance. It caters to systems that require a more compact solution than PC-oriented form factors. ARM SoCs eliminate the need for chips designed for PC platforms, significantly reducing power consumption and the amount of board space required for power conversion devices and power lines. This enables the use of smaller form factors and promotes the adoption of SMARC-compatible modules in low-power mobile devices. Using this standard, up to 9W of continuous power can be utilized for more demanding applications. 【Features】 ■ Power consumption ranges from 2W to 6W, allowing for passive cooling ■ Reduced wiring requirements 【Usage Scenarios】 Applications in mobile devices, industrial automation, medical technology, inspection and measurement, digital signage, transportation, and more. *For more details, please contact us or download from the link below.
![CPU module "SMARC" [LEC-EL]](https://image.mono.ipros.com/public/product/image/c5a/2000658280/IPROS59737930007410160021.jpeg?w=280&h=280)
SMARC short-sized module equipped with Intel 6th generation Atom x6000 processor (formerly code-named: Elkhart Lake)
The ADLINK LEC-EL is a SMARC module that supports the Intel Atom x6000 (x6425E, x6413E, x6211E, x6200FE, x6425RE) processor (formerly Elkhart Lake) with integrated Intel UHD graphics and high-speed interfaces. The LEC-EL module supports up to 8GB of LPDDR4 memory and is designed to meet strict operating temperature ranges and low power consumption envelopes, making it an ideal product for mission-critical fanless edge computing applications where safety and reliability are always required.
![CPU module "SMARC" [LEC-RB5]](https://image.mono.ipros.com/public/product/image/7a4/2000666045/IPROS20735845057925129742.jpeg?w=280&h=280)
Qualcomm QRB5165 series octa-core SoC equipped SMARC short-size module
The ADLINK LEC-RB5 is a SMARC module that features the Qualcomm QRB5165 SoC, equipped with eight Arm Cortex-A77 cores and a Qualcomm Hexagon Tensor Accelerator with up to 15 TOPS. This module is designed for applications in robotics and drones, integrating multiple IoT technologies into a single solution. The LEC-RB5 SMARC module provides artificial intelligence (AI) capabilities on-device, supports up to six cameras, and offers low power consumption. It can power robots and drones in consumer, enterprise, defense, industrial, and logistics sectors.
36×40mm, 8g! Ultra compact and lightweight! For drones, robots, medical devices, and industrial equipment.
The "PICO-IMX Series" is a CPU module equipped with the latest CPU "i.MX6" from Freescale. It features an ultra-compact size of 36×40mm and weighs only 8g, making it extremely lightweight. Additionally, it offers high performance and low power consumption at a low price, making it suitable for a wide range of applications such as drones and industrial equipment. Furthermore, during the evaluation and early development phase, it can be combined with a dedicated carrier board to start development immediately. The OS source code and drivers for the included IC are provided free of charge, allowing for quick application development. 【Specifications】 ■ CPU: i.MX6 Solo (Single Core) / Dual Lite (Dual Core) ■ CPU Technology: ARM Cortex-A9 1GHz ■ Memory: 512MB to 2GB (maximum) ■ Storage: Standard 4GB eMMC or microSD card slot ■ Supported OS: Android, Linux *For more details, please download the catalog or contact us.
This is a CPU module capable of being equipped with an operating system for industrial information processing.
The "OMAP-L138 Module" is a compact and power-efficient CPU module equipped with Texas Instruments' OMAP-L138. It supports various operating systems including Linux 2.6.37, Android, Windows Embedded, and μITRON. It can be used for a wide range of applications such as communication and control embedded devices, and information terminals. 【Features】 - Module equipped with ARM9 + DSP SoC OMAP-L138 - Capable of writing U-boot/Linux 2.6.37 to onboard Serial Flash Memory - Baseboard with standard LAN, USB, and serial interfaces - Touch panel LCD I/F support For more details, please contact us or download the catalog.
High-speed graphics, CPU module for feature-rich industrial equipment.
The "AM3359 Module" is a high-speed, low-power CPU module equipped with Texas Instruments' AM3359, which supports rich graphic capabilities. It is compatible with various operating systems including Linux, Android, and Windows Embedded CE. It can be used for a wide range of applications such as communication and control embedded devices, and information terminals. 【Features】 ○ Module with AM3359 Cortex-A8 ○ Advanced 3D graphics acceleration ○ Flexible communication interfaces ○ Realization of highly reliable display options For more details, please contact us or download the catalog.
Equipped with AM3359 Cortex-A8! A feature-rich module for industrial equipment!
The "AM3359 Module" is a high-speed, low-power CPU module equipped with Texas Instruments' AM3359, which supports rich graphic capabilities. It is compatible with various operating systems including Linux, Android, and Windows Embedded CE. It can be used for a wide range of applications such as communication and control embedded devices, and information terminals. We also offer a variety of in-house developed products, so please feel free to contact us if you are interested. 【Features】 ■ Advanced 3D graphics acceleration ■ Flexible communication interfaces ■ Reliable display options *For more details, please refer to the catalog or feel free to contact us.
OS compatible! Module for industrial information processing!
The "OMAP-L138 Module" is a compact and power-efficient CPU module equipped with Texas Instruments' OMAP-L138. It can be used for a wide range of applications, including communication and control embedded devices, and information terminals. It supports various OS platforms, including Linux 1.6.37, Android, Windows Embedded, and μITRON. We also offer our own developed products. Please feel free to contact us. 【Features】 ■ Capable of writing U-boot/Linux 2.6.37 to the onboard Serial Flash Memory ■ Baseboard equipped with standard LAN, USB, and serial interfaces ■ Touch panel LCD I/F support *For more details, please refer to the catalog or feel free to contact us.
Equipped with Renesas Electronics microcontroller (RZ/A2M)!
The "IoT-Engine RZ/A2M" is a CPU module compliant with the IoT-Engine standard. It is equipped with MIPI camera input interface, HyperRAM, and LVDS display output interface (when connected to a baseboard), enabling the development of IoT devices, including image processing and analysis. Additionally, it can send acquired images and analysis results to a server via USB, WiFi, etc. 【CPU】 ■ RZ/A2M R7S921053VCBG ■ Cortex-A9 528MHz ■ Built-in RAM 4MB ■ DRP 6 tiles *For more details, please download the PDF or feel free to contact us.
Supports 2×1Gbps Ethernet! Over 10 years of product lifespan program.
We would like to introduce the "iW-RainboW-G50M" that we handle. This product features the i.MX 93 OSM-L LGA module, equipped with an NPU that provides 0.5 TOPS of neural network performance. Additionally, it includes IEEE 802.11b/g/n/ac/ax Wi-Fi and Bluetooth 5.2. 【Features】 ■ i.MX 93 CPU ■ NPU with 0.5 TOPS of neural network performance ■ IEEE 802.11b/g/n/ac/ax Wi-Fi ■ Bluetooth 5.2 ■ Supports Cortex-A55 cores *For more details, please refer to the PDF document or feel free to contact us.
Supports a operating temperature range of -40℃ to +85℃! Equipped with various interfaces.
The "i.MX 91 SMARC System on Module iW-RainboW-G50M" is equipped with the i.MX 91 CPU, which adopts the 64-bit ARM v8.2-A architecture, and provides connectivity with IEEE 802.11b/g/n/ac/ax Wi-Fi and Bluetooth 5.3. Additionally, it features two Gigabit Ethernet PHYs, 2GB of LPDDR4 memory, 16GB of eMMC flash (expandable), and various interfaces (USB 2.0, SPI, I2C, UART, etc.), and supports an operating temperature range of -40°C to +85°C. This makes it a suitable module for vertical markets such as industrial, medical, automotive, and avionics. 【Features (partial)】 ■ i.MX 91 CPU with 64-bit ARM v8.2-A Architecture ■ IEEE 802.11b/g/n/ac/ax Wi-Fi & Bluetooth 5.3 ■ Supports Cortex-A55 cores *For more details, please download the PDF or feel free to contact us.
![[Solution Example] i.MX8M Mini - LPDDR4](https://image.mono.ipros.com/public/product/image/399/2000908483/IPROS12881362608695810350.jpeg?w=280&h=280)
Evaluation board implementation completed! Compact CPU module equipped with i.MX8M Mini finished!
To Matsudo Co., Ltd. and RITA Electronics, we have established a technical study session aimed at solving customer challenges, and the implementation of the "i.MX8M Mini - LPDDR4" board we created in this session has been completed. We will now proceed to confirm its operation, advancing waveform verification of LPDDR4 with this board, and comparing the simulation results of the circuit and patterns with the actual measured values, so that we can provide solutions to our customers. We will release detailed information as it becomes available. Please feel free to contact us if you have any requests. *Details of the case can be viewed via the related links. For more information, please do not hesitate to contact us.
NXP i.MX8M Mini equipped with Toradex's Verdin family CPU module.
The NXP i.MX8M Mini SoC is equipped with up to four powerful 64-bit Armv8 Cortex-A53 cores, providing sufficient power for typical industrial and medical applications while being a cost-effective option for running the latest graphical user interface on Linux.
NXP i.MX8 equipped with Toradex's Apalis family CPU module.
The Apalis iMX8 is a compact form factor system on module equipped with the latest NXP i.MX 8 SoC. The i.MX 8 SoC, specifically the i.MX 8QuadMx, features two Cortex-A72 and four Cortex-A35 application processor cores, as well as two FPU-enabled Cortex-M4F microcontroller cores. The latest Cortex-A cores support the Arm8 64-bit instruction set.
COM-EXPRESS TYPE6 compliant CPU module with AMD Ryzen R1000 (compact)
■Reduces overall development costs ■Global common standard specifications ■Compatible and no issues with successor products ■Long-term supply ■Flexibility in functionality changes due to BOM component modifications ■Short development period, quick market launch
COM-EXPRESS TYPE6 compliant, Intel Apollo Lake equipped CPU module (compact)
■Reduces overall development costs ■Global standard specifications ■Compatible and no issues with successors ■Long-term supply ■Flexibility in functionality changes due to BOM component modifications ■Short development period, quick market launch
COM-EXPRESS TYPE6 compliant CPU module with Intel Coffee Lake (Basic)
■Reduces overall development costs ■Global common standard specifications ■Compatible and no issues with successor products ■Long-term supply ■Flexibility in functionality changes due to BOM component modifications ■Short development period, quick market launch
COM-EXPRESS TYPE6 compliant, CPU module equipped with AMD Ryzen V2000 (compact)
■Reduces overall development costs ■Global common standard specifications ■Compatible and no issues with successor products ■Long-term supply ■Flexibility in functionality changes due to BOM component modifications ■Short development period, quick market launch
