Last Updated： Aggregation Period:Aug 06, 2025～Sep 02, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Aug 06, 2025～Sep 02, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Aug 06, 2025～Sep 02, 2025
This ranking is based on the number of page views on our site.
1～15 item / All 94 items
2nd/3rd generation Core i3/Celeron equipped CPU module
Features ■ 2nd/3rd Gen Core i3/Celeron ■ DDR3 SO-DIMM x 2 (up to 16GB) ■ Equipped with VGA, DisplayPort, DVI-I, and 24-bit single channel LVDS ■ Includes watchdog timer and digital I/O
Socket LGA1151 6th generation Core i7/i5/i3 Skylake-S compatible CPU module new
Features ■ Supports 6th generation Core i7/i5/i3 Skylake-S processors (LGA1151) ■ DDR4-2133 ECC/Non-ECC SODIMM x 1 (up to 16GB) ■ Supports VGA, LVDS/eDP, 2x DDI (DP/HDMI/DVI) displays (carrier board) ■ PCI Express 3.0 [x16] x 1 (carrier board)
6th generation Core i7/i5/i3/Celeron Skylake-H equipped CPU module new
Features ■ Type 6 COM Express module ■ Equipped with 6th generation Core i7/i5/i3/Celeron Skylake-H processors ■ DDR4-2133 ECC/Non-ECC SODIMM x 2 (up to 32GB) ■ Supports VGA, LVDS/eDP, 2x DDI (DP/HDMI/DVI) displays (carrier board) ■ PCI Express Gen3 compatible (carrier board)
Equipped with Pentium N4200/Celeron N3350/Atom E3950/E3940/E3930 CPU
Features ■ Equipped with Pentium N4200/Celeron N3350/Atom E3950/E3940/E3930 CPU. ■ Onboard memory 1867MHz DDR3L (up to 8GB) ■ Supports dual channel LVDS (18/24-bit), HDMI/DP++, DP++, and three independent display outputs. ■ 2x MIPI CSI camera (2/4 lanes) ■ 1x GbE with IEEE1588, 1x SATA 3.0, onboard eMMC ■ Extended operating temperature: -40℃ to +85℃ (optional)
Trizeps SODIMM-200 CPU module, NXP i.MX 8M Mini family
Features ■ Equipped with NXP i.MX 8M Mini application processor ■ Supports 1x Gigabit Ethernet, WiFi/Bluetooth, USB 2.0, LVDS ■ GC3202D accelerator + GCNanoUltra3D accelerator ■ Onboard LPDDR4-3200 memory up to 8GB ■ Operating temperature 0 to 70℃ (optional: -40℃ to 85℃) ■ Dimensions: 67.6 x 36.7 x 6.4 mm ■ OS Win10 IoT/Debian/Yocto/Android
NXP i.MX 8M Plus Family, ARM Cortex-A53, size 50x82mm
Features ■ Equipped with NXP i.MX8MPlus application processor ■ 2x Gigabit Ethernet; optional Wi-Fi + BT 5.0; 2x CSI camera; 2x USB 3.0; 3x USB 2.0; 1x PCI-e x1; 2x CAN Bus; 4x UART; 14x GPIOs; supports QuadSPI interface ■ Integrated GPU supporting three independent displays ■ Onboard LPDDR4-4000 with up to 6GB memory ■ Operating temperature 0 to 60°C (optional: -40°C to 85°C) ■ Size: 50 x 82 mm (1.97” x 3.23”) ■ Compatible with Linux OS
12th Core i series, 2xDDR5-4800 maximum 64GB memory, size 120x95mm
Features ■ Supports 12th generation Intel Core processors (Codename: Alder Lake – H series) ■ 2x 2.5GbE; 4x USB4 Gen 2x2; 4x USB2.0; 8x PCIe x1 Gen3, 1x PCIe x8 or 2x PCIe x4 Gen4; Optional on-board WiFi 6E + BT 5.2 ■ Intel Iris Xe Architecture with up to 96 EUs, up to 4 independent displays ■ Supports 2xDDR5-4800 memory up to 64GB ■ Operating temperature 0–60℃ (Optional: -40–85℃) ■ Dimensions: 120x95mm ■ OS Win Server2022/VxWorks7.0/Ubuntu/Linux/Yocto/Android
11th Xeon W-11000E/Core i series, equipped with 2xDDR4-3200 ECC, maximum 64GB memory.
Features ■ Supports 11th generation Intel Xeon, Core, and Celeron processors ■ 2x USB 4; 2x USB 3.2 Gen 2x2; 8x USB 2.0; 20x PCI-e Gen3 lanes; 20x PCI-e Gen4 lanes; supports up to 2x 2.5GbE ■ Intel Iris Xe Graphics Core Gen12 GPU with up to 32 EU, supports up to 4 independent displays ■ Equipped with 2x DDR4-3200 ECC memory, maximum 64GB ■ Operating temperature 0 to 60℃ (optional: -40 to 85℃) ■ Dimensions: 120x95mm ■ OS: Win10 IoT/Linux/Yocto/VxWorks7.0/Android
Intel Atom/Celeron Processor Q7 Module
● Intel Atom / Celeron Processor Q7 Module ● iManager WISE-PaaS / RMM, and Embedded Software API ● LVDS and HDMI / DP support H.264, MPEG2 HW decode/encode ● Onboard dual-channel DDR3L-1333 up to 8GB, eMMC up to 32GB ● Qseven R2.0 CPU Module ● Intel Atom / Celeron Processor Q7 Module
Low power consumption significantly reduces the board space required for power conversion devices and power lines! A credit card-sized computer module!
The SMARC is a versatile small form factor computer module targeting applications that require low power, cost-effectiveness, and high performance. It caters to systems that require a more compact solution than PC-oriented form factors. ARM SoCs eliminate the need for chips designed for PC platforms, significantly reducing power consumption and the amount of board space required for power conversion devices and power lines. This enables the use of smaller form factors and promotes the adoption of SMARC-compatible modules in low-power mobile devices. Using this standard, up to 9W of continuous power can be utilized for more demanding applications. 【Features】 ■ Power consumption ranges from 2W to 6W, allowing for passive cooling ■ Reduced wiring requirements 【Usage Scenarios】 Applications in mobile devices, industrial automation, medical technology, inspection and measurement, digital signage, transportation, and more. *For more details, please contact us or download from the link below.
![CPU module "SMARC" [LEC-AL]](https://image.mono.ipros.com/public/product/image/092/2000509326/IPROS17036517192444070096.png?w=280&h=280)
SMARC short-size module equipped with Intel Atom, Pentium, and Celeron processors.
SMARC is a definition for a diverse and compact-sized computer module targeting applications that require low power, low cost, and high performance. This module typically uses an ARM architecture SOC similar to those found in tablet computers and smartphones. Low-power SOCs and CPUs, such as X86 devices for tablets and other RISC CPUs, can also be utilized. The maximum power of the module is usually below 6W. The module is used as part of portable or stationary embedded systems. Additionally, core CPUs and associated boards, such as DRAM, boot flash, power sequencing, CPU power, GBE, and single-channel LVDS display transmitters, are connected to the module. The module is used with application-specific carrier boards, which include components like audio codecs, touch controllers, and wireless devices. By using a modular approach, it offers excellent expansion and upgrade capabilities, reduces time to market, and achieves low cost, low power, and small size.
![CPU module "SMARC" [LEC-iMX8M]](https://image.mono.ipros.com/public/product/image/831/2000510719/IPROS60774622084045659883.jpeg?w=280&h=280)
NXP i.MX 8M equipped SMARC short-size module
SMARC (Smart Mobility ARChitecture) is a multi-purpose small form factor computer module definition aimed at applications requiring low power, low cost, and high performance. The module typically uses the same or similar ARM SoCs found in many well-known devices such as tablet computers and smartphones. Alternative low-power SoCs and CPUs, such as tablet-oriented x86 devices and other RISC CPUs, can also be used. The power envelope of the module is usually less than 6W. The module serves as a building block for portable and stationary embedded systems. Core CPU and support circuitry, including DRAM, boot flash, power sequencing, CPU power, GBE, and single-channel LVDS display transmitters, are concentrated within the module. The module is used with application-specific carrier boards that implement other functions such as audio CODECs, touch controllers, and wireless devices.
![CPU module "SMARC" [LEC-EL]](https://image.mono.ipros.com/public/product/image/c5a/2000658280/IPROS59737930007410160021.jpeg?w=280&h=280)
SMARC short-sized module equipped with Intel 6th generation Atom x6000 processor (formerly code-named: Elkhart Lake)
The ADLINK LEC-EL is a SMARC module that supports the Intel Atom x6000 (x6425E, x6413E, x6211E, x6200FE, x6425RE) processor (formerly Elkhart Lake) with integrated Intel UHD graphics and high-speed interfaces. The LEC-EL module supports up to 8GB of LPDDR4 memory and is designed to meet strict operating temperature ranges and low power consumption envelopes, making it an ideal product for mission-critical fanless edge computing applications where safety and reliability are always required.
![CPU module "SMARC" [LEC-RB5]](https://image.mono.ipros.com/public/product/image/7a4/2000666045/IPROS20735845057925129742.jpeg?w=280&h=280)
Qualcomm QRB5165 series octa-core SoC equipped SMARC short-size module
The ADLINK LEC-RB5 is a SMARC module that features the Qualcomm QRB5165 SoC, equipped with eight Arm Cortex-A77 cores and a Qualcomm Hexagon Tensor Accelerator with up to 15 TOPS. This module is designed for applications in robotics and drones, integrating multiple IoT technologies into a single solution. The LEC-RB5 SMARC module provides artificial intelligence (AI) capabilities on-device, supports up to six cameras, and offers low power consumption. It can power robots and drones in consumer, enterprise, defense, industrial, and logistics sectors.
36×40mm, 8g! Ultra compact and lightweight! For drones, robots, medical devices, and industrial equipment.
The "PICO-IMX Series" is a CPU module equipped with the latest CPU "i.MX6" from Freescale. It features an ultra-compact size of 36×40mm and weighs only 8g, making it extremely lightweight. Additionally, it offers high performance and low power consumption at a low price, making it suitable for a wide range of applications such as drones and industrial equipment. Furthermore, during the evaluation and early development phase, it can be combined with a dedicated carrier board to start development immediately. The OS source code and drivers for the included IC are provided free of charge, allowing for quick application development. 【Specifications】 ■ CPU: i.MX6 Solo (Single Core) / Dual Lite (Dual Core) ■ CPU Technology: ARM Cortex-A9 1GHz ■ Memory: 512MB to 2GB (maximum) ■ Storage: Standard 4GB eMMC or microSD card slot ■ Supported OS: Android, Linux *For more details, please download the catalog or contact us.
